Book Facts
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- Title
- Semiconductor Advanced Packaging
- Author
- John H. Lau
- Reading Time
- 15.0 minutes
- Category
- Technology & The Future
- Audio
- Not available
Quick Answers
Start with the most useful search-style answers about Semiconductor Advanced Packaging.
Who is John H. Lau?
John H. Lau has a Ph.D. in theoretical and applied mechanics. He has over 40 years of R&D and manufacturing experience in electronic packaging.
Who should read Semiconductor Advanced Packaging?
This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers faci...
What is the background behind Semiconductor Advanced Packaging?
The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile,...
Key Points
MindMap
Target Audience
This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers facing practical advanced packaging problems, and those who need to choose reliable and cost-effective advanced packaging techniques. It is also suitable as a text for college and graduate students in electronics and optoelectronics.
Historical Context
The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile, high-performance computing, autonomous vehicles, IoT, and big data. These applications are driven by system-technology drivers such as 5G and AI, which demand increased semiconductor speed and density.
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