Semiconductor Advanced Packaging

This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers facing practical advanced packaging problems, and those who need to choose reliable and cost-effective advanced packaging techniques. It is also suitable as a text for college and graduate students in electronics and optoelectronics.

John H. Lau has a Ph.D. in theoretical and applied mechanics. He has over 40 years of R&D and manufacturing experience in electronic packaging. He has worked at ASM Pacific Technology, Industrial Technology Research Institute (ITRI), Hong Kong University of Science and Technology (HKUST), the Institute of Microelectronics (IME), Agilent, and HP. He is an ASME, IEEE, and IMAPS Fellow.

The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile, high-performance computing, autonomous vehicles, IoT, and big data. These applications are driven by system-technology drivers such as 5G and AI, which demand increased semiconductor speed and density.