ライブラリ Technology & The FutureSemiconductor Advanced Packaging

Semiconductor Advanced Packaging の書籍要約

著者 John H. Lau

15.0 分

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書籍情報

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書名: Semiconductor Advanced Packaging
著者: John H. Lau
読了時間: 15.0 分
カテゴリ: Technology & The Future
音声: 未対応

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Semiconductor Advanced Packaging について検索されやすい質問を先にまとめています。

John H. Lau とは？

John H. Lau has a Ph.D. in theoretical and applied mechanics. He has over 40 years of R&D and manufacturing experience in electronic packaging.

Semiconductor Advanced Packaging はどんな読者向け？

This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers faci...

Semiconductor Advanced Packaging の時代背景は？

The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile,...

要約

マインドマップ

対象読者

This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers facing practical advanced packaging problems, and those who need to choose reliable and cost-effective advanced packaging techniques. It is also suitable as a text for college and graduate students in electronics and optoelectronics.

著者背景

John H. Lau has a Ph.D. in theoretical and applied mechanics. He has over 40 years of R&D and manufacturing experience in electronic packaging. He has worked at ASM Pacific Technology, Industrial Technology Research Institute (ITRI), Hong Kong University of Science and Technology (HKUST), the Institute of Microelectronics (IME), Agilent, and HP. He is an ASME, IEEE, and IMAPS Fellow.

歴史的背景

The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile, high-performance computing, autonomous vehicles, IoT, and big data. These applications are driven by system-technology drivers such as 5G and AI, which demand increased semiconductor speed and density.