書籍資訊
不補造缺失欄位，只展示目前頁面可確認的資訊。
- 書名
- Semiconductor Advanced Packaging
- 作者
- John H. Lau
- 閱讀時間
- 15.0 分鐘
- 分類
- Technology & The Future
- 音訊
- 暫未提供
快速了解這本書
下面這些問題先整理出《Semiconductor Advanced Packaging》最值得查找的核心答案。
John H. Lau是誰？
John H. Lau has a Ph.D. in theoretical and applied mechanics. He has over 40 years of R&D and manufacturing experience in electronic packaging.
《Semiconductor Advanced Packaging》適合誰讀？
This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers faci...
《Semiconductor Advanced Packaging》的寫作背景是什麼？
The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile,...
摘要
思維導圖
目標讀者
This book is intended for specialists active or intending to become active in advanced packaging research and development, engineers and managers facing practical advanced packaging problems, and those who need to choose reliable and cost-effective advanced packaging techniques. It is also suitable as a text for college and graduate students in electronics and optoelectronics.
歷史背景
The book addresses the urgent need for comprehensive knowledge in advanced packaging technologies due to the rapid growth of applications like mobile, high-performance computing, autonomous vehicles, IoT, and big data. These applications are driven by system-technology drivers such as 5G and AI, which demand increased semiconductor speed and density.